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Adjust the copper and gold pad ratio to increase production yield
- Copy copper gold layers and the same Pad to the new layer, you can adjust the copper and gold percentage to output.
- Early response to the customer R&D Engineering Department to modify the design to increase yield and reduce the number of Sample versions.
- Increase production yield and save costs to enhance PCB’s ability to compete for orders.
Calculate the ratio of copper area and immersion gold area of the network
- Provide CAM editing work ability such as define layer attributes, polarity reverse, mirror, X, Y rotation, copy, delete, pan, alignment, layout,
Draw Pad, add Pad or Line, etc.
- Automatically calculate the exposed copper area or immersion gold area after the network green paint.
Support various of formats and easy operation
- Support RS-274X, UCAM DPF, ODB++, TGZ Read in various PCB CAM formats.
Find out in advance the over-etching of the OSP process
- Netlist analysis automatically calculates copper/gold area ratio. Find out in advance the over-etching of the OSP process.
- Improve IMG, IMS, production of mobile phone boards / PDA, PCB, etc. OSP process yield.